Sprint Challenge Brief:

Sustainable Innovations for Advanced Manufacturing

Submissions Closed

With the advent of 3D and 4D printing technologies, advanced manufacturing approaches now allow rapid prototyping and production of new components across a range of fields from aerospace to biomedical applications, from food to fashion.

The materials used to create cutting-edge items are not always sustainably produced or suitable for end-of-lifecycle reprocessing. To that end, this Sprint seeks to identify innovations which increase the sustainability profile of advanced manufacturing raw materials by:

  • Incorporating increased amounts of recycled materials,
  • Utilizing bio-derived or sustainably sourced materials,
  • Utilizing materials derived from other waste streams,
  • Novel formatting of existing materials to increase their recyclability,
  • Innovating new end-of-life processing technologies, and/or
  • Developing light-weighting innovations.

Materials used in any form of advanced manufacturing are in scope, and all technical maturities will be considered, provided there is a viable pathway to commercialization.

The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers. Our client finds submissions and novel concepts from individuals and organizations in academia and research of significant interest but welcomes all viable technology providers to respond for potential commercial opportunities.

Submission requirements:

Solvers submitting an entry should highlight key innovation areas in their submission that meet criteria including:

  • Type of innovation:
    • Material
    • Format
    • Processing
    • Light-weighting
  • Suitable type(s) of advanced manufacturing
  • Anticipated end-use application(s)
  • Technical maturity

Business Opportunity for Solvers

TechConnect will include all complete and eligible entries in an exclusive Innovation Opportunity Report for our client. Either TechConnect or the client may contact solvers with well-matched capabilities to discuss potential partnership opportunities, including – but not limited to – demonstrations, consulting, contract research, licensing, and more. TechConnect will invite top rated entries  to pitch at TechConnect World in Washington, D.C. in June 2022. Audience members will include corporate, investment, and federal prospectors with purchasing authority.

Participation Rules & Guidelines

Solvers are encouraged to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.

Download Challenge Brief

QUESTIONS? Contact challenge@techconnectventures.com