TechConnect Ventures

Sprint Challenge Brief:

Innovative Gas Barrier Technologies and Materials

Sprint Submissions Closed

Background

In support of a diverse consortium of companies, TechConnect Ventures is seeking proposals describing innovative materials or technologies which provide superior gas barrier performance versus current approaches. Barriers against gas permeation are necessary for a diverse range of industries and applications from construction and consumer goods packaging to medical devices. The inclusion of barrier technologies helps maintain the integrity, lifetime, or functionality of a product by preventing the transmission of targeted gases, such as oxygen, carbon dioxide, volatile organics, or water vapor, either into or out of a product.

The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers in this space. Submissions and novel concepts from individuals and organizations in academia and research are of significant interest, but all viable technology providers are invited to respond for potential commercial opportunities with the client.


Areas of Interest

Our clients are interested in all gas barrier approaches and materials. Relevant areas of interest include, but are not limited to:

  • New materials for usage as gas barrier layers targeting a single gas
  • Approaches that combine technologies targeting multiple gases at once
  • Multilayer structures including stacked and/or hybrid coatings
  • Nanocomposite materials to inhibit gas permeability
  • New methods for the application of gas barrier layers to plastics and paperboard
  • Improved performance of existing gas barrier technologies
  • Improved recyclability/biodegradability of existing gas barrier technologies
  • Gas barrier materials made of renewable materials
  • New approaches or materials which resolve previously unaddressed target gases

Business Opportunity for Solvers

All complete and eligible Entries will be included in our exclusive Innovation Opportunity Report that will be presented to the innovation-seeking clients and partners. Solvers with well-matched capabilities may be contacted directly by consortium members to discuss potential partnership opportunities. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.


Participation Rules & Guidelines

  1. You must complete the provided Submission webform on the Sprint Submission page.
  2. You are encouraged to submit a short presentation or pitch deck. A template is available on the Submission page.
  3. DO NOT INCLUDE ANY INFORMATION MARKED CONFIDENTIAL, PROPRIETARY, SENSITIVE OR CLASSIFIED. SUBMISSIONS MARKED AS SUCH WILL NOT BE SHARED WITH CLIENTS.

Solvers should to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.


Download Challenge Brief

QUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com