TechConnect Ventures connects emerging technology
Solvers to strategic innovation Seekers fast through

OPEN CHALLENGE SPRINTS

 




Open Challenge Sprints are fast-tracked, incentive-based Innovation Challenges without all of the hassle

 

TechConnect Ventures independently sponsors every Sprint.

  • We set and articulate the Topics.
  • We run the Challenges.
  • We recruit solutions from Solvers.
  • We evaluate the response.
  • We curate the strongest innovations.
  • We host Pitches and Showcases.
 


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As little as 6 weeks from Challenge to Opportunity

 

And we share the Sprint results with motivated Seekers who can take innovation and run with it. 

OPEN CHALLENGE SPRINT SERIES

All Sprints are grouped under common Series themes. Click on any Series below for a full list of the open, closed and pending Challenge Sprints available under that Series.

5G+ Technology Series - Submission Deadline Extended – November 20th

Uncovering technologies to enable the 5G+ industry revolution!

  • Enabling technologies for flexible and conformal antennas
  • Enabling technologies for Dynamic Spectrum Utilization and Sharing (5G+)
  • Innovations in wide bandgap radio frequency analog circuits
  • Learn More
  

Packaging Series - Submissions Due November 6th
  • Innovations in fresh food packaging
  • Novel bio-sourced plastics for rigid packaging
  • Innovations in direct printing for plastics, polymers and packaging
  • Novel moisture barrier technologies for packaging
  • Innovations in sustainable multilayer packaging technologies
  • Learn More
  

Wearables & Sensors Series - Submissions Closed
  • Wearable biometric sensors for real-time health or performance monitoring
  • Visualization or 3D-mapping of environmental chemical sensor data
  • Portable, low footprint devices for detecting toxic synthetic chemicals
  • Heating and cooling technologies for personal wearable applications
  • Learn More
  

Advanced Materials Series - Submissions Closed

Capturing cutting edge materials solutions to challenges in every sector!

  • Materials to Enable High-Resolution 3D Printing of Complex Parts
  • Sustainable, High-Performance Foams for Packaging Applications
  • Chemical Sensors for High Temperature Environments
  • Learn More
  

Biomedical & Healthcare Series - Submissions Closed

  

Expanding access to emerging medical devices, materials, diagnostics, imaging, modeling, simulation and more!

  • Bio-Inspired Omniphobic Coatings for Medical Devices
  • Learn More
 
  

Sustainability Series - Submissions Closed

Connecting Innovation Seekers and Solvers for a more sustainable future!

  • Sustainable, High-Performance Foams for Packaging Applications
  • Learn More
  
 
 

GET INVOLVED

INNOVATION SOLVERS

Get in the race!

Submit to an Active Sprint

 
INFORMATION FOR SOLVERS
» View Sprint Guidelines
» View Official Sprint Rules
 

INNOVATION SEEKERS

Join us at the finish line

Enroll as a Corporate Seeker!

 
INFORMATION FOR SEEKERS
» Seeker Packages & Pricing
» All Sprint Series & Topics  
 

Subscribe below for information on new and upcoming Sprints

POWERED BY TECHCONNECT

For over 20 years, TechConnect has provided advanced technology prospecting and commercialization programs to advance innovation partnerships within its global network. TechConnect has sourced over $250B in industry funds and $25B in government funds to date through our global Events and Innovation Challenges such as the Utilities Innovation Challenges, Advanced Materials Challenges, Defense Medical Challenges, and many more! Learn more at: www.techconnect.org

Questions?

Email your inquiries to: info@techconnectventures.com