TechConnect Ventures connects emerging technology
Solvers to strategic innovation Seekers fast through

OPEN CHALLENGE SPRINTS

ACTIVE SPRINTS & SPRINT SERIES

Click here for a look at all of our Upcoming and Scheduled Sprints






Advanced Materials Series   Deadline: Wednesday, April 14

Capturing cutting edge materials solutions to challenges in every sector!

  • Additive manufacturing/3D printing of composite materials
  • Materials and enabling technologies for flexible stretchable electronics
  • Innovative coatings technologies for lightweight material alternatives (non-steel)
  • High strength polymer materials for lightweighting in transportation
  • Learn More

 






Coatings Series – Round 2    Deadline: Monday, April 26

Don't miss our informational webinar on Tuesday, April 13 at 11 AM ET to learn more!

  • Ultra UV Protection Technologies
  • Green Technologies for Coatings
  • Technologies Enabling High Solids & Low VOC for Coatings
  • Learn More

Coatings Series – Round 1

Missed the Deadline? No problem! Late submissions are welcomed on a rolling basis. Submit today!

  • Cure on Demand for Coatings
  • Multi-functional Compounds for Coatings
  • Enhanced Surface Durability for Coatings
  • Corrosion Inhibition Innovations
  • Learn More

 






COVID-19 Series   Submissions Closed

  • Biodegradable or bio-compostable materials for single-use wipes
  • Novel materials or media for micro-/nano-particulate filtration
  • Continuously self-cleaning surfaces and coatings
  • Sustainable, biocompatible materials for personal protective equipment
  • Learn More

 






5G+ Technology Series   Submissions Closed

Uncovering technologies to enable the 5G+ industry revolution!

  • Enabling technologies for flexible and conformal antennas
  • Enabling technologies for Dynamic Spectrum Utilization and Sharing (5G+)
  • Innovations in wide bandgap radio frequency analog circuits
  • Learn More

 






Packaging Series   Submissions Closed

  • Innovations in fresh food packaging
  • Novel bio-sourced plastics for rigid packaging
  • Innovations in direct printing for plastics, polymers and packaging
  • Novel moisture barrier technologies for packaging
  • Innovations in sustainable multilayer packaging technologies
  • Learn More

 






Biomedical & Healthcare Series   Submissions Closed

Expanding access to emerging medical devices, materials, diagnostics, imaging, modeling, simulation and more!

  • Bio-Inspired Omniphobic Coatings for Medical Devices
  • Learn More

 






Sustainability Series   Submissions Closed

Connecting Innovation Seekers and Solvers for a more sustainable future!

  • Sustainable, High-Performance Foams for Packaging Applications
  • Learn More

 

 

2020 TechConnect Ventures Challenge Sprints Highlights

 

Over 500

Qualified Entries Received

+50

Commercial Actions With Clients

>30

Completed Sprints

15

Industry, Government & Non-Profit Sponsors

 

GET INVOLVED

INNOVATION SOLVERS

Get in the race!

Submit to an Active Sprint

 
INFORMATION FOR SOLVERS
» View Sprint Guidelines
» View Official Sprint Rules
 

INNOVATION SEEKERS

Join us at the finish line

Enroll as a Corporate Seeker!

 
INFORMATION FOR SEEKERS
» Seeker Packages & Pricing
» All Sprint Series & Topics  
 

Subscribe below for information on new and upcoming Sprints

Open Challenge Sprints are fast-tracked, incentive-based Innovation Challenges without all of the hassle

 

TechConnect Ventures independently sponsors every Sprint.

  • We set and articulate the Topics.
  • We run the Challenges.
  • We recruit solutions from Solvers.
  • We evaluate the response.
  • We curate the strongest innovations.
  • We host Pitches and Showcases.
 


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As little as 6 weeks from Challenge to Opportunity

 

And we share the Sprint results with motivated Seekers who can take innovation and run with it.

POWERED BY TECHCONNECT

For over 20 years, TechConnect has provided advanced technology prospecting and commercialization programs to advance innovation partnerships within its global network. TechConnect has sourced over $250B in industry funds and $25B in government funds to date through our global Events and Innovation Challenges such as the Utilities Innovation Challenges, Advanced Materials Challenges, Defense Medical Challenges, and many more! Learn more at: www.techconnect.org

Questions?

Email your inquiries to: info@techconnectventures.com