TechConnect Ventures connects emerging technology
Solvers to strategic innovation Seekers fast through



Click here for a look at all of our Upcoming and Scheduled Sprints






Advanced Materials Series 2   Submissions Closed

Capturing cutting edge materials solutions to challenges in every sector!

  • Sustainable Films and Coatings for Paperboard
  • Innovative Gas Barrier Technologies and Materials
  • Materials for Improved Cold Storage and Transportation of Perishable
  • Learn More

Advanced Materials Series 1   Submissions Closed

Capturing cutting edge materials solutions to challenges in every sector!

  • Additive manufacturing/3D printing of composite materials
  • Materials and enabling technologies for flexible stretchable electronics
  • Innovative coatings technologies for lightweight material alternatives (non-steel)
  • High strength polymer materials for lightweighting in transportation
  • Learn More


Coatings Series – Round 3    Deadline: Wednesday, June 16

  • Air Purifying Compounds for Coatings
  • Futuristic Coatings Application Innovations
  • Innovations in Coatings Applicator Cleaning
  • Learn More

Coatings Series – Round 2   

Missed the Deadline? No problem! Late submissions are welcomed on a rolling basis. Submit today!

  • Ultra UV Protection Technologies
  • Green Technologies for Coatings
  • Technologies Enabling High Solids & Low VOC for Coatings
  • Learn More

Coatings Series – Round 1

Missed the Deadline? No problem! Late submissions are welcomed on a rolling basis. Submit today!

  • Cure on Demand for Coatings
  • Multi-functional Compounds for Coatings
  • Enhanced Surface Durability for Coatings
  • Corrosion Inhibition Innovations
  • Learn More


COVID-19 Series   Submissions Closed

  • Biodegradable or bio-compostable materials for single-use wipes
  • Novel materials or media for micro-/nano-particulate filtration
  • Continuously self-cleaning surfaces and coatings
  • Sustainable, biocompatible materials for personal protective equipment
  • Learn More


5G+ Technology Series   Submissions Closed

Uncovering technologies to enable the 5G+ industry revolution!

  • Enabling technologies for flexible and conformal antennas
  • Enabling technologies for Dynamic Spectrum Utilization and Sharing (5G+)
  • Innovations in wide bandgap radio frequency analog circuits
  • Learn More


Packaging Series   Submissions Closed

  • Innovations in fresh food packaging
  • Novel bio-sourced plastics for rigid packaging
  • Innovations in direct printing for plastics, polymers and packaging
  • Novel moisture barrier technologies for packaging
  • Innovations in sustainable multilayer packaging technologies
  • Learn More


Biomedical & Healthcare Series   Submissions Closed

Expanding access to emerging medical devices, materials, diagnostics, imaging, modeling, simulation and more!

  • Bio-Inspired Omniphobic Coatings for Medical Devices
  • Learn More


Sustainability Series   Submissions Closed

Connecting Innovation Seekers and Solvers for a more sustainable future!

  • Sustainable, High-Performance Foams for Packaging Applications
  • Learn More



2020 TechConnect Ventures Challenge Sprints Highlights


Over 500

Qualified Entries Received


Commercial Actions With Clients


Completed Sprints


Industry, Government & Non-Profit Sponsors




Get in the race!

Submit to an Active Sprint



Join us at the finish line

Enroll as a Corporate Seeker!


Subscribe below for information on new and upcoming Sprints

Open Challenge Sprints are fast-tracked, incentive-based Innovation Challenges without all of the hassle


TechConnect Ventures independently sponsors every Sprint.

  • We set and articulate the Topics.
  • We run the Challenges.
  • We recruit solutions from Solvers.
  • We evaluate the response.
  • We curate the strongest innovations.
  • We host Pitches and Showcases.


As little as 6 weeks from Challenge to Opportunity


And we share the Sprint results with motivated Seekers who can take innovation and run with it.


For over 20 years, TechConnect has provided advanced technology prospecting and commercialization programs to advance innovation partnerships within its global network. TechConnect has sourced over $250B in industry funds and $25B in government funds to date through our global Events and Innovation Challenges such as the Utilities Innovation Challenges, Advanced Materials Challenges, Defense Medical Challenges, and many more! Learn more at:


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