TechConnect Ventures

Sprint Challenge Brief:

Emerging Insulation Materials for Cold Storage and Transportation

Sprint Submissions Closed

Background

In support of several packaging companies, TechConnect Ventures is seeking responses describing materials which exhibit superior insulative properties towards cold temperatures. Cold thermal insulation materials are relevant for a wide array of transportation needs for durable goods including food, pharmacological substances, and transplant. Insulation, commonly in the form of a foamed solid such as polystyrene, reduces heat transfer from the colder item to the warmer environment. The clients seek new and innovative materials with low thermal conductivity that are suitable for usage in packaging applications.

The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers in this space. Submissions and novel concepts from individuals and organizations in academia and research are of significant interest, but all viable technology providers are invited to respond for potential commercial opportunities with the client.

Areas of Interest

Our clients are interested in all insulative materials. Relevant areas of interest include, but are not limited to:

  • New materials for usage in foamed-type insulation
  • Sustainable and bio-inspired alternatives to insulation materials such as keratin and nanocellulose
  • Carbon and aluminum-based composites
  • Silica fiber based composites
  • Aerogel based materials
  • Phase change materials
  • Insulative paint or coatings e.g. nano-ceramic based thermal insulation coatings.

Business Opportunity for Solvers

All complete and eligible Entries will be included in our exclusive Innovation Opportunity Report that will be presented to the innovation-seeking clients and partners. Solvers with well-matched capabilities may be contacted directly by consortium members to discuss potential partnership opportunities. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.

Participation Rules & Guidelines

  1. You must complete the provided Submission webform on the Sprint Submission page.
  2. You are encouraged to submit a short presentation or pitch deck. A template is available on the Submission page.
  3. DO NOT INCLUDE ANY INFORMATION MARKED CONFIDENTIAL, PROPRIETARY, SENSITIVE OR CLASSIFIED. SUBMISSIONS MARKED AS SUCH WILL NOT BE SHARED WITH CLIENTS.

Solvers should to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.

Download Challenge Brief

QUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com