Sprint Challenge Brief:

Corrosion Inhibition Innovations

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BACKGROUND

In support of a global leader in coatings technology, TechConnect Ventures is calling for Entries describing innovations in high performance corrosion inhibition. The client is interested in learning about new methods or materials that exhibit superior, non-chromate corrosion inhibition performance. Of greatest interest are those approaches that are compatible with common coating binder systems and that are suitable for application over a variety of metallic substrates.

The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers in this space. Submissions and novel concepts from individuals and organizations in academia and research are of significant interest, but all viable technology providers are invited to respond for potential commercial opportunities with the client.


Requirements

Solvers submitting an Entry are encouraged to highlight key innovation areas in their Submission that meet criteria including:

  • Suitability for use in common binder systems
  • Suitability for application on multiple different substrates, including but not limited to:
    • Aluminum & aluminum alloys
    • Steel
    • Galvanized steel
    • Galvalume steel
  • Pretreatments or conversion layer technologies are of less interest

Technologies that utilize inhibitors or materials containing Cr6+, Cr3+, zinc phosphate, or sacrificial metals such as zinc or magnesium are not of interest.


Business Opportunity for Solvers

All complete and eligible Entries will be included in an exclusive Innovation Opportunity Report that will be presented to our client. Solvers with well-matched capabilities may be contacted directly by either TechConnect Ventures or the client to discuss potential partnership opportunities, including – but not limited to – demonstrations, consulting, contract research, licensing, and more. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.


Participation Rules & Guidelines

Solvers are encouraged to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.


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QUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com