Sprint Challenge Brief:

Cure on Demand for Coatings

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In support of a global leader in coatings technology, TechConnect Ventures is calling for Entries describing technologies that influence reaction kinetics of two-component coatings. In particular, the client seeks to expand application efficiency and control by increasing pot life and decreasing cure times. Approaches that reduce curing temperatures are also of great interest.

The client is open to new chemistries from non-coatings industries as well as novel resins, crosslinkers, catalysts or additives.

The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers in this space. Submissions and novel concepts from individuals and organizations in academia and research are of significant interest, but all viable technology providers are invited to respond for potential commercial opportunities with the client.


Solvers submitting an Entry are encouraged to highlight key innovation areas in their Submission that meet criteria including:

  • Increased pot life for two-component coatings
  • Decreased cure time for applied coatings
  • Temperature reduction, if applicable, for curing of coatings
    • Target temperature: below 140°F
    • Ideal temperature: ambient

Technologies utilizing raw material encapsulation may be of interest provided sufficient performance improvements can be demonstrated. Plural component spray application technologies or approaches that incorporate materials of environmental concern are not of interest.

Business Opportunity for Solvers

All complete and eligible Entries will be included in an exclusive Innovation Opportunity Report that will be presented to our client. Solvers with well-matched capabilities may be contacted directly by either TechConnect Ventures or the client to discuss potential partnership opportunities, including – but not limited to – demonstrations, consulting, contract research, licensing, and more. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.

Participation Rules & Guidelines

Solvers are encouraged to review the Rules and Guidelines provided on the Sprint page for details about participation, including submission criteria, eligibility information, and more.

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QUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com