Sprint Challenge Brief:
Technologies Enabling High Solids & Low VOC for CoatingsSubmit Now Missed the Deadline? No problem! Late submissions are welcomed on a rolling basis. Submit today!
In support of a global leader in coatings technology, TechConnect Ventures is calling for Entries describing coatings or polymers that enable low volatile organic compounds (VOCs) while still maintaining adequate application viscosity and film durability. In particular, the client is interested in technologies that support the development of coatings with higher solids. Acceptable solutions can include near 100% solids approaches (near solvent-free) or high solids water-based (at least 60% volume solids in water). All approaches need to be under 100 g/L VOC.
The goal of this sprint is to facilitate contact and interactions between the Sprint sponsor and active researchers or technology developers in this space. Submissions and novel concepts from individuals and organizations in academia and research are of significant interest, but all viable technology providers are invited to respond for potential commercial opportunities with the client.
Solvers submitting an Entry are encouraged to highlight key innovation areas in their Submission that meet criteria including:
The technology must not incorporate any exempt solvents in the proposed solution.
Any proposed technology must not have negative impacts on the appearance or performance of the final film surface. As with other Sprints in this Series, the client is not interested in solutions utilizing microplastics or materials of health or environmental concern.
Business Opportunity for Solvers
All complete and eligible Entries will be included in an exclusive Innovation Opportunity Report that will be presented to our client. Solvers with well-matched capabilities may be contacted directly by either TechConnect Ventures or the client to discuss potential partnership opportunities, including – but not limited to – demonstrations, consulting, contract research, licensing, and more. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.
Participation Rules & Guidelines
QUESTIONS? Contact Executive Director, Nick Kacsandi at firstname.lastname@example.org