TechConnect Ventures
Sprint Challenge Brief:
Innovations in sustainable multilayer packaging technologies
Sprint Submissions Closed
Background
On behalf of multiple international corporations, TechConnect Ventures is seeking responses from innovators around the world describing innovations in multilayer packaging. Multilayer packaging is widely used due to its ability to provide performance that cannot be replicated with a single polymer layer. These ultrathin laminate materials integrate multiple functionalities that combine strength, sealability, moisture and gas barrier properties, machinability, and more, while ultimately maximizing the shelf-life and quality of the products they contain. However most multilayer packages contain anywhere between 3-12 layers which are extremely difficult to separate, limiting their overall recyclability and resulting in "spent" packages being incinerated or landfilled.
areas of interest
TechConnect Ventures' clients have a critical need to identify any solutions that can bring multilayer packaging materials in line with a more sustainable future supply chain. Relevant areas of interest include, but are not limited to, materials, designs or alternative approaches for:
Business Opportunity for Solvers
All complete and eligible Entries will be included in our exclusive Innovation Opportunity Report that will be presented the innovation-seeking clients and partners. Solvers with well-matched capabilities may be contacted directly by consortium members to discuss potential partnership opportunities. Top-rated Entries may also be invited to register or participate in an upcoming TechConnect Ventures event or pitch program.
Participation Rules & Guidelines
Solvers should review the Rules and Guidelines provided on the Sprint page for full details about participation, including submission criteria, eligibility information, and more.
Download Challenge BriefQUESTIONS? Contact Executive Director, Nick Kacsandi at info@techconnectventures.com